Thermal Risk Management (TRM)
What is TRM?
TRM (“Thermal Risk Management”) is a specialized computational 3D simulation software for Printed Circuit Boards developed by Adam Research.
TRM is Thermal Analysis plus PDN. It calculates expected temperature of a PCB in details based on Currents and Component Heating.
TRM is easy to learn and use, targeted to be used by PCB Designers, Electrical and Mechanical Engineers and sometimes is used for Scientific Researchers. No knowledge of numerical methods or meshing technics needed, and it’s compatible with any PCB CAD tool .
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Why TRM?
Use TRM before starting your PCB Design, it can help you define a better board planning and Placement of components in your PCB.
If you have an existing PCB Design, use TRM to Debug Thermal Problems or Even PDN Problems created by excess of Heating, Localized Heating or Large Voltage Drops.
Thermal Problems may be hard to identify because the environment conditions could change. Having a failure product could be hard to identify due to such conditions, and it may not be able to replicate. Use TRM capabilities to analyze variations in the environment, component heat dissipation, variations in PCB Manufacturing.
TRM offers an easy-to-use parameter changes, reports, and Batch functions to help you find those minor changes in your parameters.
We have an easy interface to Altium Designer, and we work with Gerber Files.
What is calculated?
Voltage Drops
Voltage Drop is Calculated from Current flowing on Traces or Planes and the Trace Resistance of the Electric Layers in your Stackup. Trace Resistance is Temperature Dependent, TRM can handle Temperature Dependant Calculations.
Current Density
TRM can Calculate Current Density (A/mm2) base in your Current Sources and Loads setup
Trace Resistance
TRM can calculate DC Resistance of your Traces and Planes. Knowing the Trace Resistance from Source to Load and the DC Current though the path you can estimate your PDN Voltage Drop.
Temperature
TRM can Calculate the Temperature due to Heating Sources as components or Current flowing through your traces, and how this temperature increase will flow into other components or traces. TRM can handle time dependent calculations and Temperature dependent calculations.
Heat Flow
TRM can calculate Heat Flux Density (W/mm2) showing the flux vectors, knowing this is important to see what the sources and sinks of heats are interacting eachother allowing or stoping the flow of heat.
Power Density
TRM will Calculate Power Density (mW/mm3) to show the hotspot areas that will help you identify hotspots or areas where the heat is concentrated in narrow areas.
What We Offer
- It offers capabilities for Steady State and Time Dependent PCB Thermal simulations.
- Lower Price compared to other Software Packages
- Capable of doing Pre-Layout and Post-Layout Thermal Simulations.
What TRM can handle?
- Single Layer to Multilayer, up to 99 Layers
- Academic Research Structures
- SMD and Though Hole Heat Sources
- Embedded Components or bus bars or inlay metals
- Configurable PCB Stacks
- Heats ink and Thermal Adhesives
- Components, heat sinks, cold plates, cables, and other mechanical bodies can be modeled using their thermal parameters.
TRM Simulation Results and Capabilities
- Current, H-Field (Inductance) and Temperature
- Temperature Dependent Calculations
- Transients (Time Dependent Calculations)
- Electric Dependent (TRM Proprietary Resistor Model Calculator)
- Trace and PCB Heat Distribution due to Joule Heating
- Board Heating by Heat Dissipation of Components
- Environmental Interactions with PCB Assemblies
TRM Reports
Reports:
- Detailed Report, Tables by Component, Pins, Nets
- 3D Thermographic (User Defined Resolutions), Temperature, Voltage, Current Density, Electrical Conductivity, Power Density, Net Colors, Heat Flux Vectors. All these plots can be seen individually or in 3D space.
- Transient Plot of Temperature and Thermocouples
- PDN, Pictures of Voltage Potentials, Current Densities,
- Temperature Dependent Conductivity and Resistivity
- Thermocouple Features
- Heating Curves or Temperature Results on Power Cycles
TRM Setup
- Automatic Import from Altium Designer
- Layer Stackup (Number of Layers, Dielectric Heights, Copper Weight, Materials*)
- Conductive patters of layers, Gerber Files, hand drawn shapes.
- Drill Holes, Plated, non-Plated, Blind and Buried, Black drilled Holes
- Components, 3D Rectangular Bodies.
- Loads: Component Pins or Pads to Define Current Sources or Sinks (TRM can Set up Sources as Current, Voltage, or Watts)
- Thermal Resistance of Bodies to Ambient or to Board (K/W-Board, K/W-air)
- Environmental Conditions (Ambient Temperature, Cooling Conditions, Convection, and Radiation)
- TRM Built in Heat Transfer Coefficient can calculate based on Ambien Temperature, Total Power on Board, Air Speed (m/s). The Heat Transfer Coefficient Calculator Support Heat Transfer Coefficient calculations as Conduction, Convection, or Radiation.
- * TRM Provides Thermal Material Properties of most common used Materials in Printed Circuit Boards
TRM is a Product of ADAM Research, founded by Dr. Johannes Adam from Germany. More than 20 years of Experience in the fields of Electronic Cooling.
Join into this journey of learning thermal management in Printed Circuit Boards
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